News and events

Qolpac winner of "2012 Contactless and Mobile Award"

Qolpac, the end-user partner in the Chip2Foil consortium, is the winner of one of the 2012 Contactless and Mobile Awards. Qolpac received the award in the category Contacttless / NFC Innovation of the year. Their vision on the use of NFC to improve healthcare and quality of life got international recognition through this award. See this link for the official award announcement.

Qolpac presents at the MIT Enterprise Forum Cambridge

Qolpac presents its view and approach at the MIT Enterprise Forum Cambridge on NFC in Smartphones Transfroms Healthcare. The event was visited by 300+ attendants. For more information see http://www.mitforumcambridge.org/events/nfc-in-smartphones-transforms-healthcare/

Conference announcement ECTS2012

On Sept 17-20, 2012, the 4th Electronics System Integration Conference (ECTS) will be held in Amsterdam. For more information visit the conference website.

Qolpac joins the Chip2Foil consortium

Qolpac joins the Chip2Foil consortium as per January 1, 2012. Qolpac's mission statement is to "create an easy to use environment that helps people to improve their quality of life by providing knowledge, information and support by the means of E-communictaive packaging". The company replaces DSM as end-user in the project. For more information on the transaction between DSM and Qolpac see press release.

Chip2Foil participates in OLAE2011 meeting

Chip2Foil participated in the OLAE Concertation meeting 2011, organised by the EU during the ISFOE2011 conference, July 2-5, 2011, Thessaloniki, Greece

First annual review meeting

The Chip2Foil project was reviewed for the first time on the basis of the results of the first year. The review meeting took place on April 12, 2011 at Delft University of Technology. A public summary of the progress made can be found here.

Chip2Foil present at TU Delft Customer Day

The Chip2Foil project will be present at the TU Delft Customer Day on November 4, 2010. The Customer Day is an initiative from the Delft Centre for Mechatronics and Microsystems (DCMM, www.dcmm.tudelft.nl), an interdisciplinary forum for research groups from Mechanical Engineering and Electrical Engineering/DIMES. During the Customer Day, about 50 research project will be presented in a technical fair-like setting, covering themes including precision motion and metrology, micro- and nanosystems and manufacturing, mobile robots and humanoids, vehicle mechatronics, and modelling & simulation.

The Customer Day is open on invitation for managers and project leaders R&D. For more information and enquiries on entrance tickets, please contact Ms. I.N. (Inge) van Marion-Rehorst.