For more information on the Chip2Foil project please contact the coordinator: Dr. Marcel Tichem, m.tichem@tudelft.nl.
This project is supported by
FP7
the EU
News and events
BeyonDevices and Qolpac announce collaboration
BeyonDevices and Qolpac announce collaboration to start a new era in Medicine Packaging, see their press release.
Join Chip2Foil on LinkedIn
Stay tuned with Chip2Foil progress, and join discussions on smart blister packages and thin chip integration. See this link.
Chip2Foil AIPIA press release
The AIPIA organisation has included a news itme on Chip2Foil in its newsletter, see http://aipia.info/news_104_low-cost-chips-for-smart-packs.php.
Chip2Foil member of AIPIA
Chip2Foil has joined the AIPIA as a member. AIPIA is the Active and Intelligent Packaging Industry Association (office located in The Netherlands). The association has about 300 members and aims to promote the commercialisation and use of smart packaging solutions. Members are active in mainly three fields: food, pharmaceuticals and cosmetics. For more information see
Chip2Foil presents at the Dutch annual Precision Fair
The Chip2Foil project and its current results were presented in a seminar during the Dutch Annual Precison Fair on November 28, 2012, under the title "Chip2Foil: ultra-thin chip assembly for foil-based packages". For more information, please contact us at m.tichem@tudelft.nl.
Chip2Foil at the EPoSS Annual Forum
Maarten Cauwe (IMEC) has joined the EPoSS Annual Forum (Sept. 27, 2012, Paris), and gave a presentation titled "Development of integration technologies on foil as catalyst for the implementation of smart systems". Please contact us for more information.
More information on the EPoSS event can be found at http://www.smart-systems-integration.org/public/news-events/events/eposs-annual-forum-2012.
Chip2Foil presents at ESTC2012
Chip2Foil has presented project results on the 4th IEEE Electronic System Integration and Technologies Conference (ESTC), Amsterdam, Sept. 2012. Papers were presented on the Chip2Foil overall concept (Marcel Tichem), the adaptive interconnection scheme (Ashok Sridhar) and on the self-assembly process(Eda Kuran, poster). The papers will be published on the IEEE website shortly. For any information please feel free to contact us.