For more information on the Chip2Foil project please contact the coordinator: Dr. Marcel Tichem, m.tichem@tudelft.nl.

This project is supported by

FP7

the EU

Focus: technology for low cost production of communicative foils

In the need for improved intelligent control of the logistic process of high volume applications like medicine and food, disposable communicative foil-based packages will play an essential role.  These packages provide increased interaction between the packed product, the package and the user through near-field communication systems. An example application, which is the chosen demonstrator in the Chip2Foil project, is a Smart Blister package, which monitors the medicine taking behaviour of patients to ensure therapy compliance. Therapy non-compliance is a severe ethical and economic problem, leading to considerable numbers of casualties per year and high health care cost.

Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence is necessary to realise the communicative packages against cost requirements. The proposed Chip2Foil technical concept combines two main elements: (1) self-assembly for high speed chip placement with moderate accuracy, and (2) an adaptive circuitry approach, which compensates the initial placement errors and creates electrical interconnects after the chips have been placed.

The work in the project focuses on the various processes required for chip placement and interconnection:

  • Chip release and presentation;
  • Self-assembly supported chip placement;
  • Mechanical chip bonding;
  • Chip position detection;
  • Laser machining supported realisation of electrical interconnects between the chip and the circuitry on the foil.

Next to the enabling technologies, the Chip2Foil project aims to deliver a working Smart Blister demonstrator package.